Stephen A. Vicinanza | Embedded Science Generating a hardware description is a different achievement from completing a design that satisfies an engineering workflow. A recent AI Hardware Design League preprint makes that distinction visible by reporting participation, progression and physical-design…
Stephen A. Vicinanza | Embedded Science A semiconductor company combination becomes an engineering story when it changes the choices and support available to design teams. Skyworks’ October 5 announcement that it completed its combination with Qorvo makes those customer questions…
Stephen A. Vicinanza | Embedded Science The transition to a larger wafer format is a manufacturing program before it becomes an advantage in a finished power device. Infineon’s October 15 agreement with Wolfspeed provides a concrete development to examine as…
Stephen A. Vicinanza | Embedded Science A smaller motor-control assembly still has to meet the same mechanical task and electrical demands as the equipment it replaces. STMicroelectronics’ STSPIN9P announcement addresses that tension with a family of compact high-current drivers. ST…
Stephen A. Vicinanza | Embedded Science A vehicle instrument cluster must deliver information dependably as well as present it attractively. Infineon’s TRAVEO T2G CYT4EN announcement offers an MCU-based approach to display applications often associated with more complex computing platforms. Infineon…
Stephen A. Vicinanza | Embedded Science An AI server power architecture needs a defined response when equipment is connected, disconnected or develops a fault. Infineon’s new XDP8HD40S-1 brings digital control and event information to that protection problem. Infineon introduced the…
Stephen A. Vicinanza | Embedded Science The computing capacity of an AI installation is only useful when the surrounding system can move information reliably. TI’s LMK6B announcement highlights a less visible part of that infrastructure: the timing source. TI presents…
Stephen A. Vicinanza | Embedded Science Moving AI infrastructure toward higher-voltage distribution changes the questions engineers must ask about connection, interruption and fault containment. TI’s LMI800PS announcement puts an integrated isolated hot-swap controller at the center of that discussion. TI…
Stephen A. Vicinanza | Embedded Science An AI server can fail because of an electrical event that never appears in its average operating measurements. Texas Instruments’ October 12 announcement of the ADC34DSO75 directs attention toward those brief disturbances and the…
Imec is developing 300-mm GaN-on-silicon power devices with industry partners to improve manufacturing economics and enable advanced devices.
Navitas says the U.S. Army selected it for ALATTIS, a program to develop domestic manufacturing of 10-kV SiC IGBTs and PiN diodes.
Renesas' 650-V bidirectional GaN switch could replace paired FETs and simplify solar, battery, EV and AI power converters.
iDEAL Semiconductor Signs Global Distribution Agreement with DigiKey SuperQ™ silicon power MOSFETs are now available worldwide through DigiKey’s distribution platform. LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor, a developer of next-generation silicon power devices based on its patented SuperQ™…
LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor announces the expansion of its SuperQ™ 200V MOSFET portfolio, delivering industry-leading on-resistance across the most widely used power semiconductor packages. The iS20M5R5S1T sets a new benchmark as the lowest RDS(on) 200V MOSFET available in the industry-standard TOLL…
Macnica ME10: The Future of 4K AV over IP Standardized Interoperability: The ME10 is built on the IPMX (Internet Protocol Media Experience) framework, which utilizes open standards like SMPTE ST 2110 to ensure seamless interoperability between ProAV equipment from different…
GigaDevice Announces New GD32F5 Series Cortex®-M33 High-Performance MCUs NUREMBERG, Germany — April 9, 2024 — GigaDevice, a global leader in Flash Memory, 32-bit Microcontrollers, Sensors, and Power Management, has officially launched the GD32F5 series of high-performance microcontrollers. Built on the…
Silanna’s SL2001 and SL2002 laser firing system ICs for LiDAR and rangefinders integrate charging and firing on a single chip, to cut footprint by 80% and power losses by 70% SAN DIEGO, CA: February 10th, 2026 Silanna Semiconductor, a global provider…
BrainChip Holdings Ltd recently unveiled its AKD1500, a neuromorphic Edge AI accelerator co-processor, at the Embedded World North America exhibition. Designed to meet the rigorous demands of battery-powered and heat-constrained environments, this chip represents a significant leap in edge computing efficiency. The…