Stephen A. Vicinanza | Embedded Science The transition to a larger wafer format is a manufacturing program before it becomes an advantage in a finished power device. Infineon’s October 15 agreement with Wolfspeed provides a concrete development to examine as…
Imec is developing 300-mm GaN-on-silicon power devices with industry partners to improve manufacturing economics and enable advanced devices.
@ Embedded World 2026 SANTA CLARA, Calif., February 9th, 2026 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show,…
NVIDIA’s New AI Blueprints: Bridging the Gap from Warehouse to Wardrobe NVIDIA has officially unveiled two groundbreaking AI “blueprints”—the Multi-Agent Intelligent Warehouse (MAIW) and the Retail Catalog Enrichment systems. Launched on January 9, 2026, these open-source developer references are designed…
With High NA EUV, Intel Foundry () Opens New Frontier in Chipmaking APRIL 18, 2024 Published Intel Foundry Installation is complete and calibration started on Intel’s High Numerical Aperture Extreme Ultraviolet lithography tool in a clean room at Intel Corporation’s…