Silanna’s SL2001 and SL2002 laser firing system ICs for LiDAR and rangefinders integrate charging and firing on a single chip, to cut footprint by 80% and power losses by 70% SAN DIEGO, CA: February 10th, 2026 Silanna Semiconductor, a global provider of high-performance mixed-signal solutions, today announced its FirePower™ laser firing system ICs for smaller, more…
@ Embedded World 2026 SANTA CLARA, Calif., February 9th, 2026 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show, Ambarella’s theme, “The Ambarella Edge: From Agentic to Physical AI,” will anchor live demonstrations that…
America’s reliance on imported steel, a material critical for infrastructure, defense, and energy systems, has been a long-standing issue. The traditional coal-based steelmaking process, largely unchanged for centuries, is expensive, energy-intensive, and environmentally impactful. Hertha Metals, a company founded by Laureen Meroueh (SM ’18, PhD ’20 from MIT), is pioneering a revolutionary approach that promises…
The latest GeneSiC™ 5th Generation Trench-Assisted Planar (TAP) SiC MOSFET technology delivers significant improvements in performance, reliability, and robustness for AI data centers, grid and energy infrastructure, and industrial electrification. TORRANCE, CA – February 12th, 2026 — Navitas Semiconductor (Nasdaq: NVTS), an industry leader in GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced the…